HTC, Samsung deal with patent firm to steel vs. Apple, more - Electronista (Menai Bridge)

HTC, Samsung deal with patent firm to steel vs. Apple, more - Electronista

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HTC, Samsung deal with patent firm to steel vs. Apple, more Electronista HTC today joined earlier sign-up Samsung in reaching a deal with Intellectual Ventures in a move meant to gird itself against patent lawsuits from rival ... HTC and Samsung license entire Intellectual Ventures patent portfolio, gear up ...Engadget all 19 news articles »

Source: news.google.com

Samsung feted with 37 CES 2011 awards - Daily Times

Samsung feted with 37 CES 2011 awards Daily Times KARACHI: Samsung Electronics announced that it was recognised with 37 prestigious international Consumer Electronics Show (CES) 2010 innovation awards. ... and more »

Source: news.google.com